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Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems, it permits the integration of technologies from disparate backgrounds and allows separate technology optimization prior to assembly. This paper reports work on the optimization of micro-insert technology, which allows the electrical connection between the two systems. Detailed electrical...
Effect of Ni addition on the bending properties of Sn-Ag-Cu lead-free solder joints was investigated. Three point bending tests were conducted with a 324pin flip chip specimen at 10 Hz frequency and with 3mm substrate displacement. The test temperatures were 298 K and 398 K. At each temperature, Sn-l.2Ag-0.5Cu with a small amount of Ni addition, LF35 showed higher performance. The reason LF35 showed...
This paper reports the reliability of fine pitch interconnections using nano-structured nickel as the primary interconnection material. Assembly was accomplished with different bonding methods to provide organic compatible low-temperature fabrication. Au-Sn and Sn-Cu were used for solder-based assembly of nanonickel interconnections. Low modulus conductive adhesives impart lower stresses in the interconnections...
A large scattering of creep data of Pb-free solders existing in literature was investigated by conducting controlled experiments using Sn-3.5Ag alloy. Tensile specimens with different solidification rate from the melt were prepared to study the effect of solder microstructure, while simple shear (SS) and lap shear (LS) tests were added to find a mechanistic effect of multiaxial loading. Effects of...
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