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Laser voltage imaging (LVI) and laser voltage probing (LVP) are laser stimulation techniques to verify a device under test (DUT) and have been widely used for scan chain circuit debugging and various frequency-dependent failure modes. In the case of complex logic failures in advanced technology nodes, defect localization continues to be a challenge in the failure analysis field. Dynamic electrical...
Photon Emission Microscopy is the most widely used mainstream defect isolation technique in failure analysis labs. It is easy to perform and has a fast turnaround time for results. However, interpreting a photon emission micrograph to postulate the suspected defect site accurately is challenging when there are multiple abnormal hotspots and driving nets involved. This is commonly encountered in dynamic...
We present a comprehensive study of electro-optical frequency mapping (EOFM) and probing (EOP) on NAND and NAND-like structures with different sizes. Our main objective was to find out, if it is possible to detect single dysfunctional transistors in a NAND structure smaller than the laser spot just by means of the optical signal. We further investigate the impact of parasitic laser voltage signals...
Software scan diagnosis has been the de facto approach to narrow down possible defect locations in logic circuits by virtue of its speed and effectiveness. However, this capability is not supported for all product yield engineering and custom electrical failure analysis is naturally relied on. By this approach, unless the defects are gross, fault localization of internal logical nodes can be challenging...
In this paper, Focus Ion Beam (FIB) 3-point localization method and its applications in Failure Analysis (FA) were introduced. The FIB capability of material milling plays an important role in FA, but sometimes the target site of milling is invisible in FIB, making it impossible to do specific cross sections. With the help of the proposed 3-point localization method, most invisible targeted sites...
Electro optical techniques including EOFM (Electro Optical Frequency Mapping) and EOP (Electro Optical Probe) are common dynamic optical probing techniques used during failure analysis. This paper demonstrated two real cases to show the application of these techniques on the fault isolation of high resistive vias.
We evaluate a method for localization of thermal source by using optical probing. A two-dimensional imaging of infrared radiation is commonly used as localization of thermal source. At the flow of failure analysis, thermal lock-in (LIT) method by InSb camera is used to detect a leakage and short point in a package and power device sample. However, an accuracy of localization is not enough due to the...
This paper describes the use of Electrical Optical Frequency Mapping (EOFM) in amplitude and phase mode to binary search the broken scan cell and missing clock activities in scan-chain failure for Application-Specific Integrated Circuit (ASIC) die inside the sensor device. Due to the smaller size of the ASIC die at the bottom stack of the GCELL and the Evaluation Board (EVB) design which not favorable...
This work discusses visible light laser voltage probing (VIS-LVP) and gallium phosphide solid immersion lens (GaP SIL) research for Integrated Circuit (IC) analysis at Technische Universität Berlin. An overview of the challenges in connection with the ultra-precision fabrication of GaP SILs and their application is given. The use of visible light is not only opening a path for fault isolation in small...
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