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Modeling the electric field in a matrix of micro-mirrors is presented as the first application of the MEMSALab software package. The latter is dedicated to semi-automated derivation of multiscale models by asymptotic methods and will complement simulation software as finite element software. It is designed according to a principle of reusability which is called the extension-combination method developed...
3D-Printing technology, or additive manufacturing, is seeing increased interest in the electronic packaging community as it has the potential to enable cost-effective, potentially high-throughput and high degree of design customisation. At the same time there are a number of challenges related to quality, performance and reliability of the fabricated products. Technological advances and other capabilities...
The development of algorithms and models to be used for prediction of the reliability and health monitoring of components and sensors is of great importance in aerospace, automotive and power generation industry. For this purpose metamodels have been developed that are based on physical simulations and that are able to quantify the impact of uncertainties on system behavior. These surrogate metamodels...
This paper includes the analyses related to the thermal model order reduction. The simplified, one-dimensional structure is investigated. The reduction technique based on the moment matching is employed. For this purpose, the Krylov-subspace-based model order reduction method is used. The generation of the reduced Dual-Phase-Lag heat transfer model is carried out using the Arnoldi algorithm. The temperature...
In order to enable the computation of creep deformation in a large number of interconnections in simulations of thermal cycling or assembly processes of flip chip devices, a submodeling approach was developed to distribute the stress and creep evaluation to independent solvers for individual (or small number of) interconnections and thus allow a high level of parallelization of the solving effort...
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