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In the present paper, a generalized SPICE simulation model of photovoltaic modules is developed, valid for operating conditions of solar irradiance and temperature different from nominal conditions. An extraction procedure for model parameter determination is proposed using datasheet characteristics of the modules. In order to improve the model accuracy, the values of the voltage Vmp and the current...
In the paper a simple compact model of a transfer of a mechanical energy into an electrical energy is presented. The mechanical energy is stored in a vibrating bimetallic membrane with an electret layer. The membrane vibrations are forced by a set-up consisting of a cold and hot surfaces. During the vibrations this set-up acts as a variable capacitor with one of the electrodes being constantly charged...
In this paper a gradual investigation of a particular Hall sensor in SOI (“Silicon-On-Insulator”) technology is presented. The most important parameters of a specific Hall cell, based on SOI structure, are evaluated through three-dimensional physical simulations. The fact that the depth of the active silicon layer in SOI integration process is much smaller than in a regular CMOS is immediately reflected...
The design of advanced integrated circuits (IC) in particular for low power analog and radio-frequency (RF) application becomes more complex as the device level modeling confronting challenges in micro- and nano-meter CMOS processes. As present CMOS technologies continue geometry scaling the designers can benefit using dedicated SPICE MOSFET models and apply specific analog design methodologies. The...
This paper discusses on the practical example of a power diode attached to a heat sink the problem of heat transfer coefficient temperature dependence and its importance for free convection cooled electronic systems. The average values of this coefficient are estimated from multiple measurements of device cooling curves performed for different device heating currents. These values are used then for...
Recently, the Tunnel-FET is gaining interest due to its possibility to overcome the 60 mV/dec subthreshold slope limitation of the standard MOSFET. Due to its band-to-band (B2B) tunneling-based current transport mechanism, the requirements for sufficient tunneling models are raising. By taking into account various barrier shapes, tunneling distances and energy levels, the wavelet-based calculation...
In this paper, we provide a detailed analysis on the power consumption of two-stage pipeline successive approximation analog-to-digital converter (SAR ADC) and also show the relationship between stage resolution and the total power consumption in 65 nm technology. Thereafter, we evaluate the analysis results with designing a 15-bit pipeline SAR ADC in 65 nm technology and also a power comparison between...
Among the numerous solutions developed to improve the handling capability of superjunction power devices, the Deep Trench Termination (DT2) is the most adapted thanks to its lower cost and size compared to other technologies using the multiple epitaxy technique, and an easier implementation in the fabrication process. This paper presents the optimization of the Deep Trench Termination by means of...
We recently demonstrated that it is possible to model and to simulate biological functions using hardware description languages (and associated simulators) traditionally used for micro-electronics. The main drawback of these languages is that they do not support partial differential equations. However, for several applications in biology, space-dependent quantities are unavoidable. This paper deals...
This paper presents an approach to facilitate the design of a microbolometer. It is based on three main steps: the construction of a simplified model in Matlab, automatic transfer of the generated model into ANSYS and the verification of the model using ANSYS FEM (Finite Element Method) simulation. The novel idea is the second step, realized using a special application, which reads the parameters...
VeSTIC (Vertical-Slit Transistor based Integrated Circuit) architecture enables easy integration of all types of transistors on the same chip. One of the elements available in this technology is Junction Vertical-Slit Field-Effect Transistor (JVeSFET). Simulation based feasibility studies indicate that the device exhibit attractive electrical properties like DC characteristics of relatively low subthreshold...
Noise canceling techniques have been successfully applied to the design of modern multi-band RF-CMOS inductor-less receivers. However, low voltage supply requirements are imposing new design challenges which are pushing the operation of the MOS transistor into moderate or weak inversion, making the setup of closed sizing expressions a difficult task. This paper presents a Si2 OpenAccess based circuit...
The paper presents performance analysis of a permanent magnet synchronous motor (PMSM) drive with torque and speed control. The PMSM motor requires sinusoidal stator currents to produce constant torque. The paper presents constituents for the mathematical analysis of the motor operation within the dq-axis model. The mathematical model serves as inspiration for development of a drive design based on...
This paper is concerned with the development and evaluation of a number of modelling techniques which improve Qucs Harmonic Balance simulation performance of RF compact device models. Although Qucs supports conventional SPICE semiconductor device models, whose static current/voltage and dynamic charge characteristics exhibit second and higher order derivatives may not be continuous, there is no guarantee...
This paper presents a semi-empirical model of the mobile charge in the channel of a junctionless dual-gate MOSFET. Its accuracy has been demonstrated to be better than 1% of the total depletion charge for a wide range of channel thickness and substrate doping values.
In this paper we present a tool based approach for an aging-aware design method. Extending the gm/ID sizing method by operating point-dependent degradation caused by BTI and HCD enables an innovative design flow. This design flow considers performance characteristics for a fresh circuit and also those of a degraded circuit at design time. Once the degradation from a single transistor is computed,...
The Robert Bosch GmbH is the world's largest supplier of micromechanical sensors in automotive and consumer applications. Achieving a high quality and cost effectiveness in automotive and consumer applications an advanced design flow is required to fulfill these criteria. In here a method and algorithm is presented to ensure a high functionality and yields of micromechanical sensors.
A novel high speed booth encoder is designed by utilizing a new truth table. The important advantage of this structure is its low delay with respect to the previously presented papers. Moreover, generating partial products and putting the partial products array in order are done at the same time. Simulation results applied to the Hspice software in TSMC 0.18μm technology proves that the total delay...
Lab-on-chips (LOCs) are small systems, which integrate, in the same device, several functions involving chemical analysis with bio-processing functionalities typically performed in a laboratory. As a consequence, it is a multi-domain system that can be described and designed with VHDL-AMS, a hardware description language that natively supports electronics, thermics and fluidics. On the other hand,...
This paper presents the Finite Difference Method solution of Dual-Phase-Lag heat transfer model appropriate for a thin one-dimensional problems with a heat flux heating on the one side and a fixed reference temperature on the other side. The simulation results are shortly compared with Fourier-Kirchhoff heat equation model.
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