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There is a continual growth of test and validation in high reliability product applications such as automotive, military and avionics. Principally this is driven by increased use and complexity of electronic systems installed in vehicles in addition to increased end user reliability expectations. Furthermore product development cycles continue to reduce, resulting in less available time to perform...
This paper focuses on circuit simulation for thin film transistors that can be based on organic or inorganic metal-oxide materials and fabricated using solution processing such as printing or using the more conventional methods such as sputtering. In particular, the paper focuses on solution processed metal oxides. Existing compact device models are generalized in the article to include AC properties...
The time to develop new electronics products could be significantly reduced were lifetime prediction models sufficiently robust and reliable. In order for such models to achieve this the failure positions throughout the entire spectrum of test and service conditions must be accounted for. Where the loads are seen to be dynamic, such as those experienced with drops of BGA modules, then broken copper...
A carbon nanotube (CNT)/Solder hybrid bump structure is proposed in this work in order to overcome the drawbacks of high CNT resistivity while retaining the advantages of CNTs in terms of interconnect reliability. Lithographically defined hollow CNT moulds are grown by thermal chemical vapor deposition (TCVD). The space inside the CNT moulds is filled up with Sn-Au-Cu (SAC) solder spheres of around...
The main trends in consumer electronics are increasing product performances and costs reduction. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and the immanent void formation due to electromigration (EM) effects in interfaces and bulk materials like solder...
Packaging technology has to continuously evolve in order to keep pace with the demand for smaller and lighter products. One manifestation of this is the need to drastically reduce the size of flip-chip bumps and their pitch. To make things more challenging, the changes have to be mastered with new materials in response to lead-free legislation. At the same time the reliability of the electronic devices...
Carbon nanotubes (CNTs) are an ideal candidate material for electronic interconnects due to their extraordinary thermal, electrical and mechanical properties. In this study, densified CNT bumps utilizing the paper-mediated controlled method were applied as the interconnection for chip on glass (COG) applications, and the silicon chip with patterned CNT bumps was then flipped and bonded onto a glass...
Within the last years a constant increase of application temperatures for electronic packaging is observable, this is true for sensor applications, for power electronics packages and also for Smart Power Modules, integrating control logic and power ICs in one compact package. Drivers for HT use are on the one hand the introduction of GaN/SiC power electronic devices; these need modules to operate...
In this study, 0.5 wt.% CNTs-doped solder paste, that prepared by mechanical stirring, was used to detect the redistribution phenomenon of nanoparticles in the solder ball. Some of nanoparticles seriously separated out with the outward flow of solder flux, making related quantitative experiments loss their accuracy. Some of nanoparticles seriously gathered in the solder ball, having negative effects...
In this work, the influence of the copper pad geometry on the reliability of printed circuit board/ball grid array (PCB/BGA) assemblies under drop impact is assessed. The method employed is based on drop experiments combined with finite element simulations. For the experimental part, various test PCBs with three different pad designs were manufactured and tested under drop impact loading conditions...
In applications such as organic light emitting diodes (OLEDs) or photovoltaic cells a homogenous voltage distribution in the large anode layer needs to be ensured by including a metal grid with a transparent conductor layer. To ensure sufficient conductivity, relatively thick metal lines are used, which increases the risk of electrical shorts between the anode and the cathode. For this reason an insulating...
The ROPAS project (Roll-to-roll paper sensors) combines high end electronics and wireless sensors with low cost paper substrates and processing techniques that can be applied on a large scale. Paper is the next step in the printed electronics roadmap of utilising cheaper substrate materials as a replacement of silicon and PET and is generally referred to as paper electronics. The creation of highly...
The wedge bonding process on a sensor chip design has been simulated using three-dimensional FEM, across a range of die bond stiffness's, where the results and analysis thereof are discussed in this paper. Comparisons have been made with respect to the influence of the stiffness of the die bond, which has implications for both the sensitivity and accuracy of the sensors. Soft die bonds are preferable,...
The studies are focused on sintered nano silver as a possible replacement or an alternative material for current interface materials used inside electronic packages (i.e. flip chip solder joints, gold wire bonds, die-attach materials, thermal interface materials) as well as used for interconnections of embedded components, 3D stacked assembly etc. Durability of sintered nano silver joints of SMD 1206...
The present work is focused on the development of reliable, cost-effective and environmentally friendly metallic interconnection systems suitable for TSV (through silicon vias) technology, which can be considered as replacements for direct Cu/Cu bonding or high-temperature soldering. It is shown that through the judicious selection of the Sn-interlayer between the metallization constituents, Transient...
We report on the design, implementation and performance of a laminate named Thermal Power Plane and solder joints that enable dual-side electrical interconnects (EIC) to a chip stack. This novel packaging topology with a laminate on both sides of the chip stack doubles the number of EIC thus supporting increased communication bandwidth and power density. In addition, in a two-die stack, all power...
This paper investigates an approach for creating a metallurgic bond between Ø5 μm metal (Au)-coated polymer spheres (MPS) and Indium (In) pads. MPS were positioned onto In pads where the metal coating reacted with the In. The MPS were deposited by dry dispensing. The adhesion force between the MPS and the In pads was measured by acceleration/centrifugal testing. Under a centrifugal force of 34 nN,...
The electronics packaging in microsystems technology for medical applications includes various tasks. The interdisciplinary approach is the most important basis for the success of a product. For the reliable operation of medical microsystems different factors must be considered. The functionalization of a catheter depends on different influence factors. The form factor takes the most important role...
As widely known the implementation of lead-free processes induced some thermo-mechanical disadvantages. Although a lot of components do have lead-free interfaces, they are not qualified for the standard lead-free reflow soldering process due to the high peak temperatures during the soldering process. Those components have to be processed by special soldering processes like selective soldering, manual...
We study the impact of recurrent stretching on the performance of passive ultra-high frequency radio-frequency identification tag based on a textile antenna patterned from stretchable silver coated fabric. We also outline the simulation-based design of the antenna composed of this unconventional conductor and report the measured performance of the tag when attached to a shirt and worn in the upper...
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