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This paper reports the progress of microsystem integration using hybrid microassembly, based on the recently finished EU FP7 project FAB2ASM. Hybrid microassembly is a technology that merges both highspeed coarse placement and high-accuracy self-alignment technologies. This paper addresses the basic concept of hybrid microassembly for microsystem integration and its process chain: component and interfaces,...
We present a new heterogeneous integration method which enables direct incorporation of silicon-based microfluidic components in an injection-moulded polymer lab-on-a-chip (LOC). The integration is performed as part of the injection moulding process, forming direct fluidic junctions between the polymer and the silicon chip while embedding the silicon chip in the polymer chip. We have demonstrated...
An electrode created with maskless metallization of Cu tracks ablated with laser direct structuring on a liquid crystal polymer can never achieve a quality comparable to sputtered layers on silicon, but has the advantage of being molded into complex 3D structures. As these electrodes on molded interconnected devices can function as conductometric sensors capable of detecting ion changes in a liquid...
In power electronics there is currently a development to higher operating temperatures of up to 300 °C. This was made possible by an improved availability of semiconductor materials such as silicon carbide. At these temperatures conventional solders can no longer be used for Die-Attachment. Therefore new technologies are necessary. One possible solution is to use diffusion soldering. Khaja et al....
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