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A Magnesium Doped Layer (MDL) under the 2-DEG channel and a Drain Metal Extension (DME) are proposed to provide a new degree of freedom in the optimization between breakdown voltage (BV) and specific-on-resistance (Ron-sp) in AlGaN/GaN HEMTs. The surface electric field of the proposed structure is distributed more evenly when compare to the MDL-only structure with the same dimensions. A breakdown...
It has been proposed in the literature to use metal field plates (FPs) in order to increase the breakdown voltage (BV) of AlGaN/GaN HEMTs. In this article we analyze the possibility of using multiple FPs to increase the gate-to-drain BV. We show that FPs with variable oxide thickness (with thinner oxide towards the gate electrode and thicker oxide thickness towards the drain electrode) increase the...
The high breakdown voltage AlGaN/GaN HEMTs with source-terminated field plate was firstly fabricated for high frequency and high power application, employing by CF4 plasma treatment for enhancement-mode (E-mode). The results showed that by adding the distance of gate to drain, LGD from 5 um to 15um, the breakdown voltage of the device was rapidly increased 350V, whose value is from 50V to 400V while...
This paper presents a reliability evaluation of Schottky contact of AlGaN/GaN HEMT. The Schottky barrier height(SBH) and ideality factor are investigated through the current-voltage (I-V) characteristics. Two kinds of ac voltages with different frequencies (10 kHz and 1 MHz) are applied on the two similar Schottky contacts of AlGaN/GaN HEMT, and the I-V curves are measured. From the measured results,...
One way to increase the breakdown voltage in heterojunction field-effect-transistors (HFETs) on silicon substrate is to introduce a transition (buffer) layer made of a sandwich of thin AlN/AlGaN layers between the silicon substrate and the GaN well. The effect of this transition layer is to average out and, in this way, to reduce the local mechanical stress that appears between the silicon substrate...
GaN “Smart Discrete” power devices were realized using the AlGaN/GaN-on-Si platform, where two built-in intelligent self-protection functions were demonstrated. First, an AlGaN/GaN normally-off high electron mobility transistor (HEMT) with reverse drain blocking capability was realized, featuring a Schottky contact controlled drain barrier. Compared to the Schottky drain structures, the new design...
In this paper, we use a novel way to research the piezoresistance coefficients of AlGaN/GaN HEFT affected by the changes of temperatures in the structure of micro-accelerometer. It is shown that saturation current of HEFT would decrease with the increasing temperature, which is about 0.028mA/°C. However, the device can work well at the temperature range of -50°C to 50°C, which indicates that it can...
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