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Increasing demand, regarding to advanced 3D packages and high performance applications, accelerates the development of 3D silicon integrated circuit, with the aim to miniaturize and reduce cost. The study of the reliability of the through silicon via and of most critical areas for the emergence of failure remains a major concern. This paper deals with the variation of stress and strain induced in...
The aims of this study are to estimate the effect of geometrical dimensions on stiffness, stress and strain of flexible MEMS structures at pull-in and stiction positions. Microcantilevers and microbridges are often used as flexible mechanical elements in microsystems for sensing and actuation functions. Analytical models for stiffness, stress and strain of flexible microcomponents as microcantilevers...
In ULSI metallization with tantalum barriers the highest stress is generally induced in the barrier, because in the structure tantalum has the highest young modulus compared to the other materials. Regarding this barrier cracking can occur due to the high stress values. In this work possible approaches to simulate cracking appearances are selected from the literature and their feasibility will be...
Intrinsic stresses in bondpads may lead to early failure of IC's. In order to determine the intrinsic stresses in semiconductor structures, a new procedure is set up. This procedure is a combined experimental/numerical approach which consists of the following steps: First, a conductive gold layer (20 nm thickness) is deposited on the power line surface; subsequently markers (small holes) for Digital...
Silicon is an important semiconductor substrate for manufacturing solar cells. The mechanical and electrical properties of multi-crystalline silicon (mc-Si) are primarily influenced by the quality of the feedstock material and the crystallization process. In this work, numerical calculations, applying finite element analysis (FEA) and finite volume methods (FVM) are presented, in order to predict...
The soldering of solar cell strings is a critical step in the production of photovoltaic modules. Temperature induced stresses can cause cracking in the cells. During the soldering operation, the cell and the wires are heat up and expand. During the subsequent cooling phase they contract. The differential contraction between the Cu and the Si combined with thermal gradients, causes mechanical stress...
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