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The SGADER (Silicon Glass Anodic-bonding and Deep Etching Release) technology is a well-developed platform for many MEMS devices. An anti-footing aluminum film is a low cost but effective approach to minimize the footing effect in SGADER process, but such Al film cannot be removed completely with normal Al wet etchant after DRIE. In this paper, an optimized etching process for cleaning the anti-footing...
Large scale HgTe nanowires have been grown from Te nanowires by solution approach at low temperature. The widths are in the range 10-20 nm, with lengths up to 1mum. The nanowires have been characterized by uv - vis spectra, scanning electron microscopy, energy-disperse X-ray spectroscopy (EDS), transmission electron microscopy. The effects of growth temperature and time have been investigated and...
This paper presents a new 2D structure to measure a chemotactic migration of adhesive cells for analysis of cell kinetics. This structure was designed to overcome Boyden chamber's disadvantages and made real-time measurement possible in 2D. The 2D chip was made of PDMS and glass for transparency. To create more than 2% of concentration gradient for chemotaxis measurement, the PDMS chip has a gradually...
We presents a micromachined interferometric accelerometer fabricated using Silicon Glass Anodic-bonding and Deep Etching Release (SGADER) process. The accelerometer consists of a glass-silicon-glass sandwich structure. A proof mass is suspended by beams attached to the silicon support substrate and a diffraction grating on the bottom glass substrate resides under the proof mass. The sandwich structure...
In our previous study, we fabricates large grain low temperature poly-crystalline silicon film by aluminum induced crystallization (AIC) method. The fabrication process is to deposite aluminum layer on top of the a-Si:H film deposited by plasma enhanced chemical vapor deposition (PECVD) [1]. In this paper, we discussed more about the effect of different aluminum thickness of the AIC process. Five...
We present an advantageous fabrication technology for the integration of pressure sensor into the multi-sensor for micro weather station. Differing from traditional silicon piezoresistive or capacitive pressure sensor, we use platinum piezoresistive pressure sensor in the integration, which can greatly simplify the whole process and also has an excellent performance. We also use adhesive bonding with...
We demonstrate that the efficiency of DNA hybridization could be improved by introducing elevated temperature in the hot region and higher velocities in the cold region of a microfluidic chip. Compared with the conventional methods, this hybridization microchip was shown to increase the hybridization signal 4.6-fold within 30 minutes using a 1.4 kb target DNA as the test material. The increase in...
This paper presents a microfluidic chip with arc-shape electrodes array (ASEA) for separation of different-size particles/Cells based on negative dielectrophoresis (nDEP). The purpose of ASEA is to generate the dielectrophoretic force perpendicular to the microchannel direction within the gap between each pairs of arc-shape electrodes. The DEP chip consisted of two regions of ASEA; first ASEA was...
Nanofibers will be of great use in tissue engineering, filtration, protective clothing and micro/nano devices etc. In this paper a facile method is introduced to traditional electrospinning to deposit patterned nanofibers to expand its applications, in which three types of parallel top-bottom configurations of two different materials, that is, plastic (polyethylene terephthalate, PET)-glass, plastic-copper...
A single chip MEMS sensor was designed for detecting the Casimir force using parallel plate geometry. The design methodology is aimed at maintaining the parallelism between the Casimir force boundaries. The Casimir force can be estimated from the measurable capacitance shift produced by the moveable boundary. The signal to noise ratio has been calculated to be in excess of 100 without averaging due...
Measurements of the variation of vacuum level inside of field emission device when electron is emitted from carbon nanotubes (CNT) by electric field were performed. Multi-walled carbon nanotubes (MWCNT) sensor packaged with a vacuum device is used to measure the degree of a vacuum until the end of the vacuum device life. It was found that the electrical properties of MWCNTs altered with the degree...
This paper presents a simple and low-cost flip chip bumping method with vertical feedthroughs for MEMS WLCSP. The vertical feedthroughs are fabricated on glass wafer using sand-blasting, and these provide inherent aligning jig for micro-ball arrangement. The experimental evaluations using MEMS accelerometer are also presented. The proposed method can be a more cost-effective solution by eliminating...
This paper discusses a novel method of modeling and simulation of anodic bonding technique, which is widely used in fabrication of MEMS device and micro system. The emphasis are the bond expansion model and extended time formula of silicon-glass anodic bonding, and based on which, visual simulation of the process is achieved. In practical experiments, by utilizing the math model, simulation result...
An unique, sensitive, and highly specific immunoassay system using gold nanoparticles and surface-enhanced Raman spectroscopy (SERS) is described. To demonstrate the analytical capabilities of the new technique, Raman reporter (DTNB) that is coimmobilized with biospecific anti-protein A on gold nanoparticles (AuNP). Anti-protein A-AuNP-DTNB, which combing both electromagnetic field and chemical enhancement,...
This paper presents a new method for fabricating a seamless roller mold with micrometer-scaled features based on laser direct writing approach. In the process, a glass roller is first coated with a metal thin film. A high-energy pulsed laser directly machines the metal thin film and thus defines the pattern on the roller's surface. Subsequent wet etching on the patterned roller using the residual...
Bismaleimides with three prepolymer molecular weights were synthesized and fabricated into graphite fiber reinforced nano-SiO2 composites. Thermo-oxidative stability of these nano-composites under short-term isothermal exposure was studied. These composites were exposed to isothermal ageing for up to three hours. Dynamic mechanical properties and weight loss measurements indicate that for the composite...
Nanoscale field-effect transistors are of interest not only for ultra-scale integrated circuits, but also for next-generation active-matrix flat-panel displays. High-resolution flat-panel displays are typically composed of several million individual picture elements (pixels), and in active-matrix displays each pixel contains one or more field-effect transistors that precisely control the pixel brightness...
Assembly of colloidal arrays has attracted much attention over the past decade. Surface property and topology play important roles in the assembly of colloidal patterns and layers on various substrates. In this paper, we report on a novel micropattern-assisted nanoassembly (muPAN) method to organize highly ordered nanocolloidal arrays onto a nonfouling polymer surface. Polyethylene glycol (PEG) hydrogel...
As we know, the unsatisfactory field emission from the films by electrophoresis is resulted from the weak adhesion. The main aim of this paper is to improve the adhesion surrounding electrophoresis technologies. The technique we applied is referred to employ both organic binders and inorganic solution simultaneously. In addition, the influences of the applied voltage, inter-electrode distance and...
This paper reports a novel method of anodic bonding with 3 intermedia layers, silicon carbide, tungsten and silicon dioxide. The bonding process lasting 10 minutes is in vacuum, with temperature 400degC, pressing force 1000 N and voltage 1300 V. During the process, Si+ and O- ions react at the interface of silicon and glass wafers which create Si-O bonds and make bonding stable. After removing off...
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