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This paper describes the design, modeling, simulation, and fabrication of wafer level integrated passive devices (IPDs). These IPDs, comprising of a resistor, capacitor, and inductor, have been developed in the thin-film and thick metallization processing technology on silicon or high-resisitivity substrate. The electrical equivalent model of the single component structures is presented for design...
The technique of wafer level chip scale package (WLCSP) is similar as flip chip packages without using underfill. The weakest point is solder joint reliability issue so the package size of WLCSP in current industry is used less than 10times10 mm2. In this paper, we use 5.5times5.5 mm2 package size to take as test vehicle and focus on ball peeling and shear stresses to assume and simulate drop test...
To examine dispersion of the packaging reliability of WLP, we grouped Weibull distribution of the temperature cycle test lifetime every tendency. And we examined in detail the cross section of the solder which is the typical sample of each group. As a result, it became clear that the lifetime and solder resist opening diameter had correlation. Furthermore, it became clear that the destruction modes...
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