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The latest packaging trend of three dimensional system in package (3D-SiP), based either on direct 3D silicon IC stacking or on the use of silicon or organic interposers, is placed in the context of the historical trend toward smaller, faster, and cheaper electronic systems. It can be shown that virtually all packaging advances have been directed toward the reduction of total system interconnect length,...
This paper presents and verifies a co-modeling and investigation approach of noise isolation analysis in hierarchical power distribution network (PDN) for low-noise 3D system-in-package (SiP) design. It is based on a hierarchical modeling to combine the lumped circuit models at both on-chip level PDN and off-chip level PDN. The proposed hierarchical PDN model was successfully validated with good correlations...
Continuous integrated circuit (IC) package downsizing with increasing function integration have being the major evolving paths in the semiconductor industry for decades. As present packaging technologies such as lead-frame, wire bond ball grid array (BGA), and flip-chip BGA are approaching their limit gradually. An alternative new structure, the embedded technology is thus becoming one of potential...
The drop reliability of mobile electronic products has become a major concern recently. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased the stress during drop impact due to their complicate structure. In this study, evaluation and prediction of the drop reliability for SIP was performed using modeling techniques. 3D-dynamic nonlinear finite...
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