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Continuous integrated circuit (IC) package downsizing with increasing function integration have being the major evolving paths in the semiconductor industry for decades. As present packaging technologies such as lead-frame, wire bond ball grid array (BGA), and flip-chip BGA are approaching their limit gradually. An alternative new structure, the embedded technology is thus becoming one of potential...
Presented in this paper is a new chip stacking technology for very high bandwidth communication. This technology utilizes transmission line coupling between two differential pairs in the metal layers of the stacked LSI chips. We have demonstrated communication at 12.5 GHz between two differential pairs of transmission lines fabricated on different metal layers in a single chip. This technology is...
Mold compound, substrate core, solder resist, underfill and die attach materials have been used for semiconductor packages for a long time. Recently, 3D packages (such as package-on-packages, stacked-die-packages) were introduced in the electronics industry. Moreover, pursing ultimate performance requires package body downsizing more and more. 3D packages are achieved by stacking laminate substrate...
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