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Power consumption of CPU was getting higher, and die size is larger during this decade. This trend affected what thermal interface material (TIM) should be chosen. For instance higher thermally conductive TIM grease was placed into CPU package in mid dasia90s. But this was not perfect solution. Because of pumping out issue happened with big packaging warpage with thermal cycle. Against this issue...
In a recent LSI, IR drop on power supply lines is a significant problem for high speed operation, along with an increase of power consumption. In addition, relaxing external stresses during assembly processes is also a serious issue, because more fragile low-k materials are applied to interlayer dielectric films. In this paper, we have developed new structures without adding global interconnect layers...
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