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In data transmission equipment for a broadband system, high-speed serial signal transmission has become essential technology. In order to transmit high-speed serial signals with low bit-error-rate, high accuracy in impedance matching of the transmission path is needed. In this paper, first we clarify the relation between the impedance deviations of each part in a signal transmission path and the return...
This paper describes the design, modeling, simulation, and fabrication of wafer level integrated passive devices (IPDs). These IPDs, comprising of a resistor, capacitor, and inductor, have been developed in the thin-film and thick metallization processing technology on silicon or high-resisitivity substrate. The electrical equivalent model of the single component structures is presented for design...
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