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Flip chip technology is now being introduced in PoP(Package on Package) packages for the digital consumer electronics such as digital still cameras and mobile phones. PoP reduces the component height and improves the electrical performance. A MPS-C2(Metal Post Solder Chip Connection) method was developed for ultrafine pitch flip chip interconnections in mobile applications. A bare die with Sn/Ag-solder-capped...
Assembly of electronic components on rigid and/or flexible printed circuit boards is today the customary way to fabricate electronic systems in stationary, mobile and automotive applications. On the other hand, many of the demands from emerging application fields like wearable and textile electronics cannot be met if with standard technologies. These fields have therefore become mayor drivers for...
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