Search results for: Y. Wang
Applied Thermal Engineering > 2017 > 119 > C > 312-318
Microelectronics Reliability > 2015 > 55 > 9-10 > 1323-1327
2015 IEEE International Reliability Physics Symposium > MY.12.1 - MY.12.5
Mechanics Research Communications > 2014 > 62 > Complete > 57-65
Microelectronics Reliability > 2014 > 54 > 9-10 > 1911-1915
Eksploatacja i Niezawodność > 2014 > Vol. 16, no. 3 > 484--490
Przegląd Elektrotechniczny > 2013 > R. 89, nr 1a > 202--206
2011 International Reliability Physics Symposium > 6B.1.1 - 6B.1.5
2010 International Electron Devices Meeting > 2.1.1 - 2.1.4
2010 International Electron Devices Meeting > 33.5.1 - 33.5.4