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In this paper, electrically pumped III–V quantum-well lasers bonded on SiO2 with a metal-coated etched-mirror are reported. There are three key features for the device demonstrated: (i) The metal-coated etched-mirror ensures that the lasers can be used as on-chip light source and provides high reflectance, but requires no additional fabrication steps due to our process design, (ii) the bonded III–V...
SiP is becoming a popular technology as it can provide an effective method for system integration and miniaturization. The complex structure and diversity of technologies applied in SiP may cause unexpected failure. Failure analysis of SiP is getting more difficult than that of single die packaging. In this paper, failure analysis of a SiP which integrated four functional dies and one silicon interposer...
In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition...
In this work, ball grid array (BGA) Sn-Pb solder joints on Co-P (4±0.5 at.%P and 8±0.8 at.%P) and Cu substrates were investigated to clarify the effects of interfacial reaction and morphology on the shear strength of the joints during thermal cycling. The interfacial intermetallic compounds (IMCs) in the solder joints were observed by back-scattered electron scanning electron microscopy. The composition...
The use of capsule endoscope greatly contributes to the painless and hygiene diagnoses of the small intestine, which cannot be reached easily by traditional upper endoscopy or colonoscopy. However, most of current commercial capsule endoscopes only carry one or two cameras, which may lead to missing some interesting spots due to the limited field of view. A micro-ball endoscope with six CMOS image...
Icing on transmission line threats to the safe operation of power grid. At present widely used coatings including RTV coating have the hydrophobic property whose contact angle is about 110º and cannot have good anti-icing effect. Here super-hydrophobic surface whose contact angle is about 150º and contact angle hysteresis less than 5º is prepared and its anti-icing characteristic is detected. The...
Pd-coated copper wire bonding is getting more practical applications in electronic packaging because of advantages, such as ease of use, better bonding performance and reliability. ENEPIG (Electroless Ni Electroless Pd Immersion Au) is a prevalent surface finish technique that can realize more flexible substrate design, increase wire density and hence achieve device miniaturization. Study had been...
SIM cards have been more and more widely used and the failure of packaging becomes a remarkable issue. In this paper, effects of die thickness and layout, material properties and packaging process parameters on the stress of dies were analyzed based on finite element simulation. The whole simulation includes two main packaging processes: cooling after die attach and molding process. The warpage of...
The paper aims at exploring the relation between phosphatase activity and pH in landfill, optimizing the experiment condition of phosphatase in landfill on the basis of the soil enzymology and studying the characteristics of three kinds of phosphatase under different stages of refuses decomposition. The results show that the activities of Acidic Phosphatase (ACP) and Alkaline Phosphatase (AKP) activity...
An experimental study was conducted to investigate the feasibility of fabricating relatively long nanochannels on hard and brittle silicon dioxide surface using atomic force microscopy (AFM) based lithography. Specifically, the relationship between the applied AFM tip force and the resultant nanochannel depth was measured and analyzed. The nanochannels were fabricated by two different AFM lithographic...
With plating bar pitch becoming finer, the risk of ion migration on package surface under temperature humidity bias (THB) tests will be raised. In our research on fine pitch products with operating voltages of 1.5 V, 1.8 V and 3.3 V, the effects of plating bar spacing and layout that may affect ion migration on the package surface in THB tests have been studied. The critical substrate plating bar...
Wafer level packaging (WLP) technology has been used to integrate high-Q inductor on Si substrate. These inductors consist of a thick Cu electroplated rerouting to reduce series resistance and a thick dielectric layer to separate the inductors from Si substrate. The measured results show that the peak O-factor is 30 at 4 GHz for a 0.77 nH inductor, which is good agreement with the simulated performance...
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