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Shared-antipad via structure is commonly used for high-speed printed circuit board (PCB) design. Therefore, an accurate via-plane capacitance evaluation for this kind of geometry is critical to facilitate engineering design. In this paper, the analytical equation of via-plane capacitance for separated-antipad via structure is extended to the shared-antipad via structure case, by using the equivalent...
Development of low temperature wafer level hybrid bonding process using Cu/SnAg bump and photosensitive adhesive was reported. Two kinds of photosensitive adhesives, i.e., polyimide and dry film, were selected for adhesive bonding. The proposed hybrid bonding method has been successfully applied to 8 inch wafer to wafer bonding. Hybrid bonding using both polyimide and dry film achieved seam-free bonding...
Noise coupling from a working IC to the neighboring victim antenna is estimated by decomposition based reciprocity theorem. The overall problem is decomposed into two parts. In the first part, the IC is turned on and the victim antenna is turned off, which is defined as forward problem. The second part is called reverse problem in which case the victim antenna is excited while the IC is turned off...
3D WLCSP using via last TSV (through silicon via) technology is an ideal packaging technology to meet small-form-factor, high I/O density, high-speed and most important, lower cost. For thin 3D WLCSP with TSVs, a number of critical processes need to be developed such as oxide etch, via cleaning and wafer de-bonding. In the present paper, processes for 8 inch, thin WLCSP with TSV diameter of 40µm and...
3D WLCSP using via last TSV (through silicon via) technology is an ideal packaging technology to meet small-form-factor, lightweight, low-profile, high I/O density, high-speed and most important, lower cost. For thin 3D WLCSP with TSVs, a number of critical processes need to be developed. Because of the applying of the temporary adhesive for device and carrier wafer bonding, process integration steps...
A domain decomposition approach, namely hybrid boundary-integral and finite-element method, is proposed for signal integrity analysis of an infinitely-large plate pair with multi-vias in a shared anti-pad. Each via structure is modeled as a multi-mode network containing top/bottom transverse electromagnetic (TEM) ports associated with vias and parallel-plate ports a little far away from the anti-pad...
An irregular plate pair with multiple vias sharing an anti-pad is decomposed into top/bottom plate-thickness domain and parallel-plate domain whose admittance matrices are calculated by three-dimensional (3D) finite element method (FEM) and hybrid 3D/2D FEM. Combined admittance matrix algorithm is used to obtain the final admittance matrix of the plate pair including finite thickness plates. The widely-used...
In this paper, practical test patterns are designed to calculate the characteristics of Through-Silicon Via (TSV) pairs in a silicon interposer. Proposed test patterns include probing pads, traces and TSVs, which are modeled by a combination of impedances and admittances. Performance of the test patterns is obtained from simulation models built in full wave simulation solver. TSV response is then...
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