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The authors have successfully demonstrated 3-D high-resolution real-time in vivo imaging by the miniature MEMS-scanner based DAC (dual-axes confocal) probes in both form-factors (10 and 5-mm diameter) by acquiring reflectance and fluorescence images. From the obtained high quality images, the DAC microscope shows great potential to substantially enhance clinical imaging practice by permitting sub-surface...
We report on a new 3-DOF CMOS-MEMS electrothermal probe, featuring embedded piezoresistive sensors. These probes have the potential to be used independently for general 3-DOF nanoscale manipulation/manufacturing/scanning without external actuation and sensing. In this probe design, 3-DOF piezoresistive sensors are used to track probe actuation and applied force in all three directions, and thermal...
We report on high current, low contact resistance, platinum-coated, lever-based CMOS-MEMS electrothermal probes with embedded displacement and force sensors for MEMS Instrumented Self-Configuring Integrated Circuits (MISCICs). The MISCIC vision is to use MEMS conductive probes to reconfigure ICs, mainly RF ICs such as inductors, by mechanically addressing and passing current pulses through resistance...
We report tip platform platinum sputtering and piezoresistive force sensing employed in CMOS-MEMS electrothermal probes. Pt sputtering is developed to achieve small and reliable electrical contact resistance. Piezoresistive sensors are used to track the force applied on the tips to detect the mechanical contact of the probe and the substrate and to aid in tip registration to the patterned substrates.
We describe multiple embedded polysilicon resistive sensors in CMOS-MEMS electrothermal probes as a step toward creating probe arrays for passing current on ICs to reconfigure resistance change (RC) vias. When not in contact, a low-resistivity unsilicided polysilicon (LP) resistor detects probe displacement indirectly through the temperature coefficient of resistance (TCR) effect. When in contact...
We report on new lever-based CMOS-MEMS electrothermal probes for memory-intensive self-configuring integrated circuits (MISCICs). The MISCIC vision is to use MEMS conductive probes to reconfigure ICs, mainly RF ICs such as inductors, by mechanically addressing and passing current through resistance change (RC) vias embedded within the chip circuitry. The lever-based actuation causes the probe tips...
In this work, silicon microchannel coolers were made using the deep ion reactive etching (DIRE) technique. Stable and homogeneous carbon nanotube (CNT) suspension was also prepared. Meanwhile, a closed-loop cooling test system was developed to investigate the heat removal of the silicon microchannel cooler with different coolants. The experimental setup included a test module, a minipump for providing...
As power density in electronic system is approaching a level that conventional cooling methods canpsilat handle, reliability of microsystems is of large concern. In this paper, novel schemes for heat dissipation on electrical components have been reviewed with a strong focus on using carbon nanotubes (CNTs) as cooling fins as a basic approach. With an extraordinary high thermal conductivity, CNT is...
We report on our progress on the development of CMOS-MEMS electrothermal conductive probes for memory-intensive self-configuring integrated circuits (MISCICs). The MISCIC vision is to use MEMS conductive probes to reconfigure circuits by mechanically addressing and passing current through resistance change vias embedded within the chip circuitry. Cantilevered probes are designed with 1, 4, 9, 16 and...
Summary form only given. One important function of microsystem packaging is to remove the heat generated by the integrated circuits (ICs). The thermal management of microsystems has now become more crucial as the power density of ICs increases dramatically. To remove the big amount of heat is a big challenge for the packaging technology. An attractive solution is to utilize new developed nanotechnologies...
In this paper, we explored the utility of a 2D piezoelectric Micromachined Ultrasound Transducers (pMUTs) for a 3D Echo Particle Image Velocimetry (Echo PIV) system. The design was achieved by first examining optimal mechanical-electrical coupling coefficient (MECC) for a pMUT subsequently characterizing system performance. A combination of analytical and finite element modeling was used to accomplish...
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