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In this paper we report experimental results of through silicon vias (TSVs) at an early processing step which are used in a context of reliability assessment. Parameter studies and evaluation of stresses using finite element analysis contribute to an optimization of processing parameters. Our results comprise nanoindentations to characterize copper protrusion, elasticity and hardness from the top...
Through encapsulant vias (TEVs) are an interconnect technology which enables 3D stacking and double sided re-routing of packages encapsulated with epoxy molding compound. These interconnects are formed by Cu-plated holes through the encapsulant and can typically be routed by an RDL (redistribution layer). In order to enable prolonged function of these interconnects, thermo-mechanical reliability has...
Nanoindentation is one of the most known method for investigating the properties of thin films. The materials can be assessed by means of elastic mechanical properties (hardness and Young's modulus). However, the author's research works show that it is possible to obtain the elastic as well as the plastic material behavior of the investigated thin layer. It can be done by using the nanoindentation...
High temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesion to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronic components heat is generated locally (bond wire or chip surface) degrading the moulding compound and reducing the adhesion which in...
It is well known that high temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesions to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. During normal operation of electronic components, heat is generated locally (bond wire, or chip surface) degrading the moulding compound and reducing the...
Interfacial adhesion between the Epoxy Molding Compound (EMC) and the copper-based leadframe is one of the major concerns in the qualification of plastic packages. Since the conventional shear testing methods used in industry do not consider the residual stresses in the shear samples, they are only used as a qualitative testing method for the EMC qualifications. However, since these tests are based...
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