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Thermal management issue has been a bottleneck with the development of modern electronics towards higher speed, miniaturization and functionalization. To address this problem, novel polymer composites with improved thermal conductivity is strongly demanded. However, traditional polymer composites with roughly designed structure and high filler content usually cannot meet the increasing requirements...
Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
For electronic packaging applications, polymer based SiO2 composites with low CTE and low elastic modulus are of great importance to the thermal or mechanical stress relief and reliability improvement. However, it's still a great challenge to achieve these goals simultaneously by incorporating conventional SiO2 filler into resin matrix. In this study, we prepared the mesoporous SiO2 filler through...
We report a surface modification method to improve the filler-matrix interface in silica-epoxy composites. A double-layer modification scheme was used to coat silica with polysiloxane-based surface modifier molecules. The polysiloxane coating reaction was confirmed by SEM, DSC, and TGA analyses, and the coated silica exhibit good chemical compatibility with the epoxy matrix. The CTE of epoxy composite...
In this paper, we report a method for preparing a silicone-based nanocomposite material for high brightness light emitting diode (LED) packaging. High refractive index (RI) encapsulant is desired in order to reduce the RI contrast between the LED chip and air, thus increasing the light extraction efficiency (LEE). In our method, TiO2 nanoparticles were added to the silicone resin to prepare the nanocomposite,...
High thermal conductivity, electrical insulating polymer composite has a wide range of applications in electronic packaging. We report the magnetic alignment of hexagonal boron nitride (hBN) in epoxy composite and the greatly enhanced thermal conductivities of the composites. Superparamagnetic iron oxide nanoparticles are used to modify the surface of hBN, making it responsive to the external magnetic...
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