Search results for: Hsuan-Ling Kao
International Journal of Circuit Theory and Applications > 45 > 11 > 1621 - 1636
Microelectronics Reliability > 2017 > 78 > C > 267-271
Journal of Electronic Materials > 2018 > 47 > 1 > 677-683
IEEE Transactions on Electron Devices > 2017 > 64 > 10 > 4065 - 4070
IEEE Transactions on Nanotechnology > 2017 > 16 > 5 > 876 - 879
Surface and Coatings Technology > 2017 > 320 > C > 568-573
Journal of Alloys and Compounds > 2017 > 703 > C > 204-209
IEEE Microwave and Wireless Components Letters > 2017 > 27 > 3 > 281 - 283
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 4 > 622 - 629
Microelectronics Reliability > 2016 > 59 > C > 44-48
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 2 > 282 - 289
Microwave and Optical Technology Letters > 58 > 3 > 546 - 549
Thin Solid Films > 2015 > 584 > Complete > 198-203
Microelectronic Engineering > 2014 > 118 > Complete > 20-24
Microelectronic Engineering > 2014 > 114 > Complete > 117-120
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 7 > 1228 - 1236
IEEE Antennas and Wireless Propagation Letters > 2014 > 13 > 1172 - 1175