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As one of the most important kinds of distributed generation systems, the micro turbine generation system can be flexibly installed near the end user, and becomes an important trend of development in DGS gradually. The high speed permanent magnetic generator (HSPMG) can be properly applied in a micro turbine generation system and benefits the system from high efficiency, high power density, simple...
Numerical simulation of micro-bumped flip chips mounted on a TSV interposer is conducted to study the thermal performance of the package. The 3D package, which consists of two chips, each dissipating 4W, is evaluated under various conditions with its thermal resistances θja θjb, θjc and θjma determined according to JEDEC or MIL-STD standard. Instead of building the detailed model, equivalent thermal...
We present a novel thermal conductivity detector design in which output is minimally affected by changing flow rates in a microchannel. In gas chromatography systems, pressure fluctuations can result in false peaks and an unstable baseline, reducing the systems limit of detection. Furthermore, ramping the temperature of a separation column, used in many chemical separations, changes the viscosity...
Micro-Thermal Conductivity Detectors (µTCDs) have been designed, fabricated and tested in a gas chromatography system to show a correlation between detector design and the mean free path of the carrier gas. Our tests show that for a fixed detector design, the maximum possible response is limited by the Knudsen number (the ratio of the mean free path of the gas and chamber critical dimensions). Therefore,...
We have developed a novel, calibration free, micro electromechanical device and method for the measurement of linear flow rate in a micro-gas chromatography (GC) system This design enables the integration of a flow rate measurement with a high sensitivity thermal conductivity detector (TCD) reported at MEMS 2009. Accurate knowledge of the flow rate is of vital importance when quantifying the results...
Because of Moore's (scaling/integration) law, the Cu/low-k silicon chip is getting bigger, the pin-out is getting higher, and the pitch is getting finer. Thus, the conventional organic buildup substrates cannot support these kinds of silicon chips anymore. To address these needs, Si interposer with TSV has emerged as a good solution to provide high wiring density interconnection, to minimize CTE mismatch...
Design, fabrication and testing of a micro thermal conductivity detector (muTCD) with a detection limit of 260 parts per billion (hexane in helium), no excess dead-volume, low power consumption, fast response time (150 musec) and low sensitivity to flow rate is described herein. Significantly, this muTCD is shown to have a linear response and high sensitivity across a 104-fold concentration range;...
Nanostructure materials exhibit different properties from those of corresponding bulk substances, the decrease in the grain size of the material leads to a drastic increase in the density of grain boundaries, which brings out a significant reduction in thermal conductivity, kappa, and so improve the value of thermoelectric figure-of-merit, ZT. But the decreased grain size reduces the electrical conductivity...
Ca3-xBaxCo4O9 (x = 0~0.4) bulks were prepared by sol-gel and spark plasma sintering (SPS) method, and the effects of preparation process on texture and thermoelectric properties were discussed in detail. The results show that SPS process is helpful to form texture. The bulks are composed of plate-like grains, which are aligned to (001) plane. To some extent, the orientation and density of Ca3Co4O9...
A novel and computationally efficient analysis procedure is developed and applied to design particulate composites in general, and thermal interface materials in particular, in the present paper. The procedure is based on constructing complex behavioral fields through Boolean operations (compositions) on primitive fields. It is demonstrated that the Boolean operations and an associated meshless implementation...
The effective behavior of particulate thermal interface materials depend, in addition to particle/matrix conductivities and volume loading of the particles, on the randomness of distribution, on the randomness of the size as well as on the interfacial thermal resistance between the particles and matrix. However, the relative contributions of these effects have not been identified in the literature...
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