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As the data rate of Low Power Double Data Rate 4 (LPDDR4) memory now exceeds 3.2 Gb/s, it is becoming more difficult to meet the target specifications. While testing has become of utmost importance, it is not viable to have a direct access to the signal pins in a package on package configuration due to the densely located array of solder balls; instead, a test interposer with an excellent electrical...
10nm 2nd generation BEOL technology is described with an optimized illumination system and multi-patterning lithography. While the optimized illumination system offered a possibility to pattern reduced metal pitches in the preferred orientation, difficulties of T-T and T-S patterning still remained. It was overcome by increasing the number of available multi-patterning colors from 2 to 4. First-ever...
In this study, magnetically coupled coil design for high efficiency wireless power transfer (WPT) in PCB-toactive silicon (Si) interposer is proposed and analyzed using Z-parameter analysis. For strong magnetic coupling between transmitter (Tx) coil on PCB and receiver (Rx) coil on Si-interposer, each coil structure is selected considering process dimension difference between PCB and Si-interposer...
In this paper, crosstalk included eye diagram of high-speed and wide I/O interposer channels are simulated and analyzed. To analyze the crosstalk effect of various substrate channels, silicon, glass, and organic interposers are simulated and compared under the same physical dimensions. In addition, crosstalk included eye diagrams are accurately estimated in short time using 8 worst case input signals...
As a solution to limitlessly growing demand on miniaturization of electronic devices, through silicon via (TSV) based 3-dimensional integrated circuits (3D-IC) have brought another era of technology evolution. However, one of the remaining challenges to overcome is to increase the reliability of the products. Due to the instability of TSV fabrication process, different types of failure may be caused,...
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