Search results for: Chun-Hu Cheng
physica status solidi (RRL) – Rapid Research Letters > 14 > 12 > n/a - n/a
physica status solidi (RRL) – Rapid Research Letters > 13 > 12 > n/a - n/a
physica status solidi (RRL) – Rapid Research Letters > 13 > 5 > n/a - n/a
physica status solidi (RRL) – Rapid Research Letters > 13 > 2 > n/a - n/a
Journal of Magnetism and Magnetic Materials > 2018 > 451 > C > 288-294
Journal of Magnetism and Magnetic Materials > 2018 > 449 > C > 157-164
International Journal of Circuit Theory and Applications > 45 > 11 > 1621 - 1636
Microelectronics Reliability > 2017 > 78 > C > 267-271
Microelectronics Reliability > 2017 > 78 > C > 111-117
Journal of Electronic Materials > 2018 > 47 > 1 > 677-683
physica status solidi (RRL) – Rapid Research Letters > 11 > 10 > n/a - n/a
IEEE Transactions on Electron Devices > 2017 > 64 > 10 > 4200 - 4205
Intermetallics > 2017 > 89 > C > 111-117
IEEE Transactions on Nanotechnology > 2017 > 16 > 5 > 876 - 879
IEEE Transactions on Electron Devices > 2017 > 64 > 8 > 3498 - 3501
Journal of Alloys and Compounds > 2017 > 707 > C > 162-166
physica status solidi (RRL) – Rapid Research Letters > 11 > 3 > n/a - n/a