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As mobile and handheld devices become more functionalities, required to accommodate more frequency bands, and to meet small form factor requirements. IPD (Integrated Passive Device) offers small form factor, and high performance benefits for RF solutions. To achieve a high performance RF filters, high-Q inductor is a key factor. A possible best high-Q inductor can be achieved is by Glass based solenoid...
It is demonstrated that the high quality factor with multi-layers of thick metal spiral inductors and low harmonics power level can be achieved by using a mature glass substrate technology. The thicker copper metal stacking for inductor is greater than 30 µm. The quality factor of inductors can achieve 70-100 in this study. In addition, the compact size of RF diplexer with thicker copper layer applied...
It is demonstrated that the high quality factor of thick metal spiral inductors, 3D solenoid inductor and low harmonics power level can be achieved by using a mature glass substrate technology. The quality factor of inductors in a 2D/3D type can achieve 70∼100 in this study. The harmonics power level is measured along transmission line and 2nd /3rd harmonics can be below −110 dBm at 30 dBm input power...
In this study, measurements are made to validate the electrical performance of a Through Silicon Via (TSV) interconnection up to 40GHz, and the results of the wideband scalable model of TSV is proposed and compared with the measured data. Measurement of the TSV structure demonstrates its advantages of low parasitic capacitance and low insertion loss at high frequency.
TSV (Through Silicon Via) is the key enabling technology for 2.5D & 3D IC packaging solution. As the 2.5D interposer design pushing towards smaller & shorter via due to I/O density and electrical performance, the warpage of thinner interposer is therefore much more challenging in thin wafer handling and assembly process. In this presentation, a TSV structure is introduced with fabricated interposer...
A novel wireless connectivity module by using embedded high dielectric constant (Dk) material in a 6 layer build-up substrate to form the passive circuit is presented. The module shows 18% size shrinking while embedded BPF, Balun and Divider circuit. The embedded BPF and Balun show 2 dB and 1 dB insertion loss at passband respectively. An efficient design methodology is demonstrated for high performance...
This letter presents very small LC resonator‐based bandpass filters on an organic substrate for wireless system applications. Because of the lack of a fabrication process for high‐capacitance density capacitors on the applicable substrate, the proposed bandpass filter designs are based on either modified‐T or coupled‐resonator prototype. By carefully taking parasitic and coupling effects into account...
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