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Wire bonding has been the dominant mode of chip to substrate interconnection for many decades. The most common metal used has been gold which is rather malleable and very resistant to oxidation and corrosion. The surge in commodity prices over the last few years has prompted the introduction of copper as a lower cost alternative. While copper has some advantages electrically, thermally and mechanically,...
Fine pitch gold wire bonding is the pre-eminent technology for die interconnection and has been advanced to very fine wire diameters. Copper wire bonding has been used for many years as well but was relegated to large wire diameters in automotive and power applications. The surge in gold commodity prices to more than 1,000 USD has fueled great interest in converting fine wire packaging from gold to...
Fine pitch Cu wire bonding is at the cusp of becoming main stream. Many challenges had to be overcome when making the transition from fine pitch Au wire bonding to fine pitch Cu wire bonding in a high volume manufacturing environment. The challenges for Cu wire bonding arise from the inherent properties of Cu: propensity to oxidize, increased hardness, slow intermetallic growth whilst dice are (still)...
This study evaluated room temperature creep properties of the intermetallic compounds (IMCs) formed at the interfaces between Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the commonly used electronic substrates (Cu, Ni and Ag) using nanoindentation. The creep stress exponent (CSE), representing creep resistance, in the decreasing order was Cu, Ni and then Ag based IMCs, which was in good agreement with...
Elastic properties of a solid are closely related to many fundamental solid-state properties. Theoretical calculations on elastic constants are well motivated by the advance in computational technologies, especially when mechanical testing on submicron components is extremely difficult. Elastic constants of a number of anisotropic lattice systems have been calculated based on the density functional...
The effect of transition metal (TM) additive of Ni, Co or Zn on the interfacial reactions of the solder joints between Sn-Ag-Cu (SAC) solder and the Cu/Ni(P)/Au substrate was investigated, especially when subsequent to multi-reflowing. (Cu,Ni)6Sn5 formed at the interface of all the joints but the SAC-Ni of which the interfacial compound was (Ni,Cu)6Sn5. The interfacial compounds of the SAC-Co and...
Nanotribological characteristics, including coefficient of friction, wear coefficient, and wear resistance, of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds developed by annealing Sn-Cu or Sn-Ni diffusion couples were investigated in this work. The scratch test conditions combine a constant normal load of 10, 20, or 30 mN and a scratch rate of 0.1 1, or 10 mum/s. Experimental results indicate...
The Cu-Sn alloys have been used since ancient times. At present they attract much interest since the formation and growth of Cu-Sn intermetallic compounds, namely, Cu3Sn and Cu6Sn5, play an important role in the kinetics of the soldering reaction in microelectronics packaging. Their formation kinetics as well as mechanical properties has shown to be crucial for the integrity of solder joints. In this...
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