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In this paper, we apply the sequential thermal-mechanical coupling analysis that solves, in turn, the transient temperature field and subsequent thermomechanical deformations to investigate thermal characteristics along with fatigue reliability of board-level thin-profile fine-pitch ball-grid-array chip-scale packages under coupled power- and thermal-cycling test conditions. Pure thermal-cycling and...
The authors derive in this paper equations of motion of board-level electronic packages subjected to swept sine vibration loads following the support excitation scheme. A single degree of freedom elastoplastic structural system is constructed to benchmark multi-step harmonic analysis schemes proposed in this study. Applications of the harmonic analysis schemes to calculating response spectra of a...
We derive in this paper equations of motion of board-level electronic packages subjected to swept sine vibration loads following the support excitation scheme. Harmonic analysis is performed based on the argument such that at each loading state over the swept sine process, hysteresis responses of solder joints following the isotropic hardening rule vanish fairly quickly so that plasticity is fully...
In this paper, the response spectra analysis is introduced to obtain transient structural responses of an undamped multiple degrees of freedom structural system subjected to impact acceleration pulse of a half-sine waveform. The JEDEC drop test condition B is specifically chosen to investigate transient structural responses of a board-level test vehicle comprised of a test board and a mounted package...
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