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As we known, the measurement of junction-to-case thermal resistance (Rth-JC) of semiconductor power devices is very important. In this paper, an approach of transient dual interface method (TDIM) with gate-source voltage (Vgs) as the temperature sensitive electrical parameters (TSEP) was investigated for the measurement of Rth-JC of packaged SiC MOSFET. The measured Rth-JC value of packaged SiC MOSFET...
In this paper, we demonstrate that femtosecond laser pulse written fiber Bragg gratings (FBGs) fabricated in specialty highly birefringent micro-structured optical fiber (MSF) can be used for high pressure and high temperature monitoring in downhole applications. The design of the micro-structure allows encoding the pressure information into the spectral separation between the two Bragg peaks reflected...
Due to the energy-efficiency and environment-friendliness, magnetic refrigeration based on the magnetocaloric effect (MCE) has extensively been investigated during the past years, which is considered as a promising alternative to conventional gas-compression refrigeration [1-3]. In this context, the materials undergoing magnetic transition, especially the first-order magnetic transition (FOMT), have...
Ultrathin Co/Pt multilayer system with strong perpendicular magnetic anisotropy (PMA) nowadays has been paid more attention to be used, as an ideal model system, in the study of current or field-driven domain wall motion [1, 2]. It has also shown ion irradiation technique is very effective to modify physical properties and anisotropy of magnetic nanostructures [3, 4]. The PMA in ultra-thin Co/Pt multilayers...
The objective of this study is to propose an in-situ measurement of the warpage of the PCB during reflow process (or SMT process) using strain gauges. In the experiments, a full-field shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and the PCB with DIMM sockets during solder reflow heating. A finite element method (FEM) is used to analyze the thermally-induced...
In recent years coherent terahertz (THz) radiation from stacks containing nearly 1000 Bi2Sr2CaCu2O8 (BSCCO) intrinsic Josephson junctions (IJJs) has attracted a lot of research interest. However, in most cases, reported have been frequencies well below 1 THz, or typically around 500 GHz, which obviously can be a bottleneck for many applications. In our experiments, by optimizing sample structures...
Spin caloritronics, exploiting the interaction between spin with heat currents, offers a promising path to further reduction in both the size and power consumption of solid state devices. Despite recent observations of spin dependent thermal transport by several groups, the underlying physical mechanism remains unsettled.1–3 Our study has demonstrated the profound effect of substrate on the spin-dependent...
A simple method is proposed as an alternative to conventional oxygen plasma treatment to modify surface property of ITO anode of a fluorescent OLED. This was achieved by treating the ITO anode in supercritical CO2 (SCCO2) fluid with H2O2. The SCCO2/H2O2 treatments yielded an ITO work function of 5.35 eV after 15 min treatment at 85 °C and 4000 psi, which was significant higher than 4.8 eV of the as-cleaned...
This paper summarizes our recent investigations of nano-wire n type tunneling field effect transistor (n-TFET) reliability by experimental measurements and physical analysis [1-3]. Large PBTI and HC degradations which are very different from those in conventional n-MOSFETs were observed. The results are interpreted by different degradation mechanism in TFET.
Trends in the packaging of semiconductors are towards miniaturization and high functionality. The package-on-package (PoP) with increasing demands is beneficial in cost and space saving. This study conducts the assembly of the PoP component through the stacking process. Samples are subject to thermal cycling test condition, 0°C to 100°C. The failure of samples is defined as when the measured resistance...
The purpose of this study is to in-situ measure the warpage of the PCB with surface-mount dual in-line memory module (DIMM) sockets during reflow process by using strain gages. In the experiments, a full-field shadow moire is used for measuring real-time out-of-plane deformations (or warpage) of the PCB with DIMM sockets under heating condition. A finite element method (FEM) is used to analyze the...
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