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In this study, a novel anisotropic conductive film (ACF) bonding method using vertical ultrasonic vibration was developed and demonstrated in flex-on-board applications. In terms of ultrasonic bonding processes, the relations between ACF temperature and ultrasonic variables were both experimentally and theoretically investigated. Considering the effects ultrasonic variables on ACF temperature, a novel...
In this study, a novel anisotropic conductive film (ACF) bonding method for flexible substrate-organic rigid board bonding was investigated using an ultrasonic vibration. And the ultrasonic (U/S) ACF bonding was characterized in terms of adhesion strength, electrical continuity in comparison with those of thermo-compression (T/C) bonding. An ultrasonic bonder was used to produce ultrasonic vibration...
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