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Cu wire bonding has taken over Au wire bonding due to its cost savings and other performance advantages such as higher mechanical strength for complex looping and better electrical performance. Currently, Cu wire bonding of 28nm node devices has been realized in high volume production [1]. To meet the challenges of device reliability for these advanced node devices, we need to understand how to achieve...
With the transition from Au wire bonding to Cu wire bonding, both bare Cu wire and Pd coated Cu (PCC) wire are now commonly used. Humidity reliability is particularly challenging for Cu wire bonding. In this paper, 18 um (0.7 mil) bare Cu and PCC wire are used in the wire bonding and HAST reliability test. Various factors can influence the HAST reliability outcome. The key factors examined in this...
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