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This paper demonstrates that aging prior to extrusion (APE) can greatly enhance the mechanical properties of an extruded Mg–7.6Al–0.4Zn alloy. The fine Mg17Al12 precipitates formed by APE reduce the average size of dynamically recrystallized grains and increase the amount of small Mg17Al12 particles present after extrusion, thereby improving the strength of the alloy. This APE treatment also enhances...
In this study, the interfacial reaction between Sn-3.0Ag-0.5Cu solder on Cu-35wt%Zn, Cu-20wt%Zn-15wt%Ni and Cu-25wt%Zn-10wt%Ni substrates were studied after reflow at 250°C for 90s and isothermal aging at 150°C for 50, 100, 250, and 500h. Addition of Zn or Ni into Cu wetting layer was effective to suppress the excessive growth of IMC and avoid the microvoids formation after thermal aging. In the initial...
We developed an Au/Ni-Zn/Ti under bump metallurgy (UBM) for Pb-free solders. Au/Ni-Zn/Ti and Au/Ni/Ti UBM stacks were deposited on SiO2/Si wafer using conventional magnetron sputtering and Sn solder was electroplated on UBM stacks. Then, Sn solder on UBM were reflowed at 260°C for 15 s and aged at 150°C up to 1000 h. The measurement of film stress using a curvature method showed Ni-Zn films having...
The excessive growth of intermetallic compound (IMC) and the formation of microvoids in the interface between Sn-Ag-Cu (SAC) solder and Cu substrate have been a serious problem which may degrade the solder joints reliability. Recently, a new Cu-Zn alloy solder wetting layer for the Pb-free solders has been developed to reduce the IMC growth rate. In this paper, the kinetics of IMC growth and the shear...
The intermetallic growth in the Sn-Ag-Cu (SAC) solder joints fabricated on Cu or Cu-Zn solder wetting layer and its effect on the drop impact reliability have been studied. The drop test specimens were fabricated by connecting two printed circuit boards by reflowing SASC 405 solder balls on Cu or Cu-Zn wetting layers. And the drop test specimens were aged at 150degC up to 500 hrs. The well known bi-layer...
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