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We developed an Au/Ni-Zn/Ti under bump metallurgy (UBM) for Pb-free solders. Au/Ni-Zn/Ti and Au/Ni/Ti UBM stacks were deposited on SiO2/Si wafer using conventional magnetron sputtering and Sn solder was electroplated on UBM stacks. Then, Sn solder on UBM were reflowed at 260°C for 15 s and aged at 150°C up to 1000 h. The measurement of film stress using a curvature method showed Ni-Zn films having...
Numerical calculation tools based on the upper-bound method, which could be used in the forging of gear-like components having various deformation features, are suggested. The numerical calculation tools can calculate both the internal and external flow of metal within dies, such as an external involute spur gear, a square spline and internal serrations. A complex calculation tool for the forging...
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