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As electronic parts increase its performance and miniaturize the size, package substrates are demanded to be thinner as well as higher in density. Thin packages such as Chip Scale Package (CSP) require high elastic modulus and low coefficient of thermal expansion with high density wiring to reduce warpage. To enable high density wiring, while maintaining crucial properties and minimal warpage, various...
As electronic parts increase its performance and miniaturize in its size, package substrates are demanded to be thinner and higher in density. But higher density substrates using insulating films give higher warpage values when they are very thin, due to its low modulus. Packages with glass-cloth prepreg as its outer-layer have lower warpage, but making a 40 μm pitch package with them are difficult...
Purpose To correlate both primary lesion 18F-fluorodeoxyglucose (FDG) maximum standardized uptake value (SUVmax) and diffusion-weighted imaging (DWI) apparent diffusion coefficient (ADC) with clinicopathological prognostic factors and compare the prognostic value of these indexes in breast cancer. Methods The study population consisted of 44 patients with 44 breast cancers visible on both preoperative...
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