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This is a case study of an early failure analysis on a chip fabricated on the 40nm technology node. A large leakage current was observed in the high voltage (HV) supply after the chip was stressed as a part of an early failure rate (EFR) test. Electrical failure analysis (EFA) using Backside Emission spectroscopy [1] and Optical Beam Induced Resistance Change (OBIRcH) [2] showed the existence of hotspots,...
This paper presents a simple and cost-effective method to enhance 65nm SRAM technology performance using a single stress liner, resulting in 25% increase in cell read current. A novel slot contact process allows significant improvement of NMOS drive current without PMOS degradation, by relaxing the undesirable strain in the PMOS. This new slot process also results in significant reduction of the S/D...
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