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In-field test of electronic devices is becoming increasingly important due to the wide adoption of electronic systems in safety-critical applications. Hence, it is crucial to devise and deploy effective solutions supporting the test during the operational phase of all the components of an electronic system, including the memory modules embedded in a SoC. Some key aspects include the possible reuse...
Environmental and electrical stress phases are commonly applied to automotive devices during manufacturing test. The combination of thermal and electrical stress is used to give rise to early life latent failures that can be naturally found in a population of devices by accelerating aging processes through Burn-In test phases. This paper provides a methodology to evaluate and compare the stress procedures...
Thermal and electrical stress phases are commonly applied to automotive devices at the end of manufacturing test to give rise to early life latent failures. This paper proposes a new methodology to optimize the stress procedures during the Burn-In phase. In the proposed method, stress of CPU, RAM memory and FLASH memory are run in parallel using DMA and CACHE interventions. The paper reports also...
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