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Transferring molding process is widely used in the plastic IC packaging. Die cracking failures due to transfer molding process may occur. In this paper, an investigation on the die fracture and its failure probability is conducted. The approaches and results of die strength characterization, FE modeling on the laminate-based packages, and simulation-based prediction of the die fracture probability...
The first part of this paper deals with the analysis of layer buckling and delamination of thin him multi-layer structures that are used in flexible display applications. To this end, 250 nm thick indium tin oxide (ITO) layers have been deposited on a 200 mum thick high temperature aromatic polyester substrate (Arylitetrade) with a 3 mum silica-acrylate hybrid hard coat (HC). Typical buckle morphologies...
Nowadays, one of the trends in microelectronic packaging is to integrate multi-functional systems into one package, resulting in more applications of highly dissimilar materials in the form of laminated thin films or composite structures. As a consequence, the number of interfaces increases. Often, the interface between these dissimilar materials is where the failure is most likely to occur especially...
In this paper, results of experiments and FE simulations on mechanical issues of poly-and single crystalline silicon on ultra-thin polyimide substrates are presented. Formation and propagation of cracks within the silicon and dielectric layers are then studied under controlled bending and tensile tests using bending and tensile tools being custom designed for this purpose. The results show that the...
Nowadays, one of the trends in microelectronic packaging is to integrate multi-functional systems into one package, resulting in more applications of highly dissimilar materials in the form of laminated thin films or composite structures. As a consequence, the number of interfaces increases. Often, the interface between these dissimilar materials is where the failure is most likely to occur especially...
Initial studies have demonstrated that specially designed and fabricated microelectronics embedded in flexible substrates can maintain functionality when subjected to stretching as well as bending. The acceptable flexibility and stretchability for ultra-thin substrate could be reached by embedding the ultra-thin substrate into flexible polyimide and patterning the silicon into square or hexagon segmentations...
Nowadays, one of the trends of microelectronic packaging is to integrate multiple functional systems into one package, resulting in more applications of multimaterials in the form of laminated thin films or stacks. As a consequence, the number of interfaces increases. This causes tremendous mechanical problems, for instance interfacial delamination. Prediction of interface delamination is typically...
Passivation cracking is one of the main failures of integrated circuits (ICs) and thermo-mechanical failures are the root cause. A major cause for these failures is due to the mismatch of thermal and mechanical parameters while manufacturing or working, especially stress concentration at the interface and the edge. The ICs for different fixing position endure different thermal cycles, overload and...
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