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Light Emitting Diodes (LEDs) as an emerging light source has been rapidly developed due to its considerable advantages including high energy efficiency, extremely long life and environmentally friendly. Since packaging accounts for the major part of the total cost, a novel molding process for wafer level LED packaging will be presented in this paper, which could decrease the total cost by the wafer...
Two series of devices, bonding quality testing devices and torsional strength testing devices, were designed to fully investigate the mechanical strength of the micro anchor-beam combined structure, which is fabricated by silicon-on-glass process. It's proved that the bonding quality of the anchor degenerates severely when the anchor size becomes very small. And the results of anodic bonding quality...
A novel low-cost molding process to prepare polymer-based micro-lens arrays with spacers for optical applications was investigated in this paper. The process consists of the following steps: 1) hemispherical glass bubble arrays, used as the upper part of the molds, was prepared by combining a hot-forming process and a chemical-foaming process; 2) the silicon mold, used as the lower part of the molds,...
In this paper, we investigate a novel Chip-On-Board (COB) process for wafer level LED packaging using micro glass-bubble caps and silicon substrates. The COB packaging process is firstly studied experimentally, which consists of the following steps. First, a silicon substrate with lead lines is prepared. Second, LEDs are mounted on the silicon substrate followed by wire-bonding. Third, phosphor is...
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