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High-performance computing is driving sub-10µm substrate interconnect pitches to support high-density logic-to-memory interconnections in advanced 2.5D packaging. A new ultra-thin surface finish, electroless Pd autocatalytic Au (EPAG), was recently developed by Atotech GmBH to address extraneous plating encountered at these fine pitches with conventional finishes, such as electroless Ni immersion...
Direct metallization of bare glass with copper is required to reach the full potential low-cost benefit of glass interposers. However, this poses a fundamental materials challenge associated with copper-to-glass adhesion. Intermediate polymer liners on glass have been used by others, adding an extra material and processing step. In this paper, three approaches to direct metallization of copper to...
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