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In the context of the development of silicon photonics, various Ti- and Ni-based alloyed metallizations have been investigated for the purpose of forming low resistivity and Si CMOS-compatible contacts to n-InP. The innovative Ni2P metallization combined with an in situ Ar+ preclean represents the most suitable available solution for the formation of ohmic contacts with a specific contact resistivity...
In this paper, some key fundamental aspects of Metal / Insulator / Semiconductor contacts as well as practical issues occurring with their implementation are reviewed in order to fully comprehend the opportunities and limitations of this approach.
In this work we introduce the use of physical plasmas (e.g. Ar- and He-based plasmas) in order to study the in situ cleaning (prior to metal deposition) of InGaAs layers dedicated to the realisation of self-aligned contacts. For the characterisation of cleaning efficiency, we performed surface analyses like X-ray photoelectron spectroscopy and Fourier transform infrared spectroscopy in attenuated...
This paper deals with the thermal and morphological stabilization of nickel-based silicides and germanides using tungsten and fluorine implantation for 3D monolithic CMOS applications. The incorporation of few % of W and/or F at various steps of the salicide process can successfully address two major issues: the morphological degradation (agglomeration) of NiSi and NiGe layers on one side and the...
We review in this paper some key enabling process integration modules, the development of which will allow pursuing the trend of energy efficiency improvement in sub-28nm FDSOI technologies.
Nanoelectronics will have to face major challenges in the next decades in order to proceed with increasing progress to the sub 10 nm nodes level and face the challenge to approach zero variability. The main requirements will be to reduce leakage currents and reduce access resistances at the same time in order to fully exploit 3D integration at the device, elementary function, chip and system. New...
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