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A series novel composites based on poly(L‐lactide) (PLLA) oligomer modified mesoporous silica (MCM41) homogeneous dispersed into poly(L‐lactide‐co‐trimethylene carbonate‐co‐glycolide) (PLTG) terpolymer has been successfully prepared. The structure of PLTG terpolymer was characterized by 1H NMR. The structure and properties of modified and unmodified MCM41 were attested by Fourier transform infrared...
High temperature is a rigorous environment factor for reliability tests in automotive IC evaluations. In this paper, we study Isub with Vds stress correlation at different temperatures, and propose a quadratic fit between Isub and Vds stress. The HCI (Hot Carrier Injection) lifetime is studied for temperature dependence at the same time.
The trench performance of UMOS is very important because it directly affects chip performance. This paper reveals that, during the HTGB test, the trench MOS gate device is seriously degraded due to poor trench uniformity and sidewall profile. In addition, for ultra thick gate oxide (about 500A), the GOI Vramp criteria should be revised.
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