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I/O has become the limiting factor in scaling down size and power toward the goal of invisible computing. Achieving this goal will require composing optimized and specialized--yet reusable--components with an interconnect that permits tiny, ultra-low-power systems. In contrast to today's interconnects, which are limited by power-hungry pull-ups or high-overhead chip select lines, the authors' approach...
We introduce Harmonium, a novel ultra-wideband RF localization architecture that achieves decimeter-scale accuracy indoors. Harmonium strikes a balance between tag simplicity and processing complexity to provide fast and accurate indoor location estimates. Harmonium uses only commodity components and consists of a small, inexpensive, lightweight, and FCC-compliant ultra-wideband transmitter or tag,...
As we show in this paper, I/O has become the limiting factor in scaling down size and power toward the goal of invisible computing. Achieving this goal will require composing optimized and specialized—yet reusable—components with an interconnect that permits tiny, ultra-low power systems. In contrast to today's interconnects which are limited by power-hungry pull-ups or high-overhead chip-select lines,...
We propose an ultra-low power interconnect bus for millimeter-scale wireless sensor nodes. Using only 4 IO pads, the bus minimizes the required chip real estate, enabling ultrasmall form factors in modular sensor node designs. Low power is achieved using a “clockless” design of member nodes while aggressive power gating allows an ultra-low power standby mode with only 53 gates powered on. An integrated...
We present a 2×4×4mm3 imaging system complete with optics, wireless communication, battery, power management, solar harvesting, processor and memory. The system features a 160×160 resolution CMOS image sensor with 304nW continuous in-pixel motion detection mode. System components are fabricated in five different IC layers and die-stacked for minimal form factor. Photovoltaic (PV) cells face the opposite...
A 1.0 mm general-purpose sensor node platform with heterogeneous multi-layer structure is proposed. The sensor platform benefits from modularity by allowing the addition/removal of IC layers. A new low power C interface is introduced for energy efficient inter-layer communication with compatibility to commercial C protocols. A self-adapting power management unit is proposed...
ABSTRACT In this work we expose the challenges of interfacing both conventional and new systems with an extremely resource constrained platform. We find that even when attempts are made to utilize an industry standard protocol (I2C), necessary protocol modifications for ultra-low power design means that interfacing remains non-trivial. We present a functional 0.4mm × 0.8mm ARM Cortex M0 with 3KB of...
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