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In this paper, The relationship between the temperature rise of the heat generating components densely mounted in a grid pattern on the board and the various board design conditions was discussed. Based on the discussion, a simple estimation formula that can be used for temperature estimation for densely mounted components was derived.
Recently, thermal problem of electronics is becoming more serious, because electronic devices have been downsizing. Especially, since very high electrical field generates in power devices, it is possible that nano-micro scale high temperature hot spots appear in the device. The hot spot temperature has an impact on performance of electronics, and the hot spot has potential of malfunctioning of the...
In this paper, temperature estimation method of heat-generating components in dense mounting was discussed. Specifically, simulation of components arranged densely in a grid pattern on a PCB was carried out. The relationship between temperature rise around the heat generating portion and various conditions such as component pitch and pad size were clarified. Additionally, a temperature estimation...
In recent years, thermal management of electronic components is getting all the more important with the advance in downsizing and higher density packaging of electronics. The authors have proposed a concept of thermal network modeling to be used in estimating the temperature rise of small chip components to establish the copper pattern design rule. In this paper, based on the proposed concept, we...
Thermal contact resistance is one of the important parameters for accurate temperature prediction in CFD (Computational Fluid Dynamics) analysis. However, thermal contact resistance is dependent on surface condition of materials, and estimation of thermal contact resistance is difficult. In this study, CFD analysis with various size of small air gap on the contact surface of the material was conducted,...
For thermal management of electrical equipment, thermal contact resistance is one of the important parameters. However, thermal contact resistance is dependent on various factors, for example surface roughness, the contact pressure and the hardness of the material. Therefore, quantitative evaluation is difficult. Nowadays, CFD (Computational Fluid Dynamics) analysis is widely used in thermal design...
The circuit (printed board) designers play an important role in the recent thermal design of electronic devices. Generally, small chip type components have low heat generation. However, recently, the heat generation density of small chip type components is increasing along with the downsizing of electronics. Small chip type components have no cooling devices, and heat dissipation from the components...
In recent years, LED is attracted attention as new light sources. LED bulb is one of the LED usages and this is a replacement for conventional indoor lighting such as incandescent light bulbs and fluorescent lamps. LED bulbs have advantages such as long life and low power consumption compared to other light sources. However volume of LED chip is small and the amount of heat generation per area is...
With development and downsizing of the computer in vehicles, increase of power density, in other words heat generation density, of the computer in the vehicle becomes important problem for thermal design. For thermal design of the computer in the vehicle, computational analysis is widely used. However, discrepancy between analysis results and experimental results always becomes problem. And we should...
Temperature distributions in 3-D integrated circuits (ICs) are analyzed with a test structure, which has a top-tier chip attached on a bottom dummy chip with adhesive layer. The devices with four kinds of top-tier chip thickness ${t} _{\rm {Si}}$ of 50–410 $ {\mu }\text{m}$ were fabricated by a standard 0.18 $ {\mu }\text{m}$ CMOS process. The test structure consists of 24 sensor blocks, each...
This paper proposes a new compact thermal model (CTM) for the microprocessor package based on a one-dimensional thermal network with average temperature nodes. Different from the two-resistor model and the DELPHI model, the proposed CTM doesn't assume an isothermal surface, but sets plate heat sources along the top surface of the silicon die and the bottom surface of the solder balls layer. It is...
This paper describes the effect of the variation of energy relaxation time on thermal properties of power Si MOSFET (Metal - Oxide - Semiconductor Field-Effect Transistor) using Electro-Thermal Analysis. In our previous study, we investigated thermal properties of power Si MOSFET using Electro-Thermal Analysis. However, in these calculations, to reduce calculation cost, we assume energy relaxation...
This paper describes the relationship between the boundary thermal resistance and the hot spot temperature in power Si MOSFET. Power Si MOSFET is widely used semiconductor device in various area, for example car electronics. Since high voltage is applied to power Si MOSFET, high electric field (more than 10 V/m) is generated. Under such high electric field, electron thermal energy becomes much higher...
This paper describes the effect of variation of doping density on thermal properties of power Si MOSFET. For accurate thermal design according to miniaturization of electronics, we should consider thermal properties of semiconductor devices in chips. Additionally, power Si MOSFET, which is a type of semiconductor devices, has large thermal problems. Then, we focus on power Si M OSFET, and investigate...
This paper describes the effect of cooling from a surface of power Si MOSFET on hot spot temperature. In traditional thermal design of electronics, the temperature distribution of chips is assumed to be uniform for simplicity of thermal design. However, in recent years, thermal problems of electronics are more serious, because electronics have been downsizing. Therefore, we should consider the temperature...
This paper investigates transient temperature prediction of microprocessor hot spot by utilizing one-dimensional thermal network with average temperature nodes. Different from traditional thermal network, introduced one-dimensional thermal network in this paper consists of not only material thermal resistances and material thermal capacitances but also thermal spreading resistances and a thermal local...
The heat flow distribution in IGBT package is significantly affected by its interfacing materials and dimension of metal frame. In order to increase heat-sink capability which is critical for kW IGBT device, lateral heat spreading technology is introduced. To design in such 3D heat flux structure in real power device package, accurate thermal distribution analysis is required. Using three dimensional...
Thermal flow simulation based on computational fluid dynamics (CFD) is applied to the thermal design of electronic equipment. This paper discusses the applicability of the multiple reference frame (MRF) approach, which is a new method for modeling an axial cooling fan, to the thermal flow simulation of electronic equipment. In this study, we performed flow visualization of the exhaust air flow pattern...
We welcome you to the International Conference on Electronics Packaging (ICEP) 2014, the largest and premier international conference on electronics packaging in Japan, to be held from April 23rd to 25th at the Toyama International Conference Center in Toyama, Japan.
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