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The drive for small form factor and foot print area packages is being fueled by consumer electronic applications that today constitute 50% of semiconductor revenue. Mobile phones are experiencing explosive growth both in terms of unit shipments and increased complexity at the same time. In just one decade mobile phone has transformed from a simple communication device into more complex system integrating...
The demand for wireless communications is increasing through use of smart phones, 3G handsets wherein high speed and reliable data communication are crucial requirements. Multi-bands networks help to facilitate these at higher range of radio frequencies. In many wireless communications, power amplifiers (PA) are used to increase the amplitude of relatively weak signals. These PAs depend on matching...
3D packaging has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-in-package solution. 3D packages contain multiple heat sources that produce high power density. Heat dissipation has become a critical issue. However, unlike the single-chip package, for which thermal resistance can be easily defined and measured, the presence...
The present work aims at the study of the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new device was comprehensive studied. The thermal resistances of IHS...
The present work aims at studying the cooling performance of a thermoelectric device that integrated with integrated heat spreader (IHS) on a flip-chip plastic ball grid array (FC-PBGA) package. The new thermoelectric device herein is fabricated on the metal substrates by flip-chip assembly process. Thermal performance of the new package was comprehensive studied. The thermal resistances of IHS with/without...
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