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Plasma processes have long been used in various stages of semiconductor device fabrication. Plasma enhanced chemical vapor deposition (PECVD) has been widely used as a low temperature silicon dioxide film deposition method in the semiconductor industry. [1,2] Various modes of plasma etching techniques also have been playing major roles in the silicon industry. Physical vapor deposition (PVD or sputtering),...
This paper describes a new paradigm of defect sampling, the Defect Intelligent Sampling System (Defect-ISS), which introduces a far more effective in-line defect inspection and process control method in a diverse product and technology node mass production environment. Three important benefits are realized with the implementation of Defect-ISS: (1) Sampling stability (2) Satisfactory coverage of products...
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