The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Thermal simulation and analysis play a significant role in development of new generation of DC/DC package design and system integration. This paper presents an innovative model for thermal simulation and analysis with the application of active area loading. In traditional model, resistor, inductor, transformer and similar components are usually simplified into a homogeneous body with the same size...
In this paper, the Sn3.0Ag0.5Cu and 63Sn37Pb were mixed by a certain mass ratio to research reliability of mixed solder material. Firstly, in order to obtain the data of the 9 fitting Anand parameters of mixed solder joint material, a series of tensile tests were carried out under the condition of 5 strain rates from 5.0E-5/s to 1.0E-3/s and at 4 temperatures 253K, 298K, 348K and 398K. Secondly, the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.