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Based on current Compliant Wafer Level Package structure, a novel compliant structure with embedded MEMS air-gap is designed, Then, taking DDR DRAM chip as research object, 3D finite element model is established by ANSYS software with designed bump structure. Analysis on stress-strain response of key fatigue failure solder joints under thermal loading condition is carried out. The thermal fatigue...
Thermal simulation and analysis play a significant role in development of new generation of DC/DC package design and system integration. This paper presents an innovative model for thermal simulation and analysis with the application of active area loading. In traditional model, resistor, inductor, transformer and similar components are usually simplified into a homogeneous body with the same size...
LED with the advantages of high brightness, long-lifetime, energy-saving and environmental protection is widely used in varieties of fields especially the lighting industry. Thermal performance is the key to high power LED lighting integration, which has got broad concern and research. And the thermal management and thermal reliability has been improved quickly in recent years. While, more and more...
A good solution to meet the need of miniaturization and low cost for micro-electronics packaging is wafer level package technology. But thermal mechanical reliability problem which generated from the coefficient of thermal expansion (CTE) mismatch between the chip and the PCB limit the application of larger size wafer level package. To solve this problem, the prototype of compliant package is proposed...
Along with electronic products developing toward lighter, thinner, and multi-functional integration, chip scale package (CSP) has been widely used in electronic packages. Wafer level packaging (WLP) has become one dominant technology. However, applications of WLP are limited by solder joint fatigue due to stress generated by the CTE mismatch among different materials. Compliant wafer level packaging...
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