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A novel 1.7kV, 500A low inductance half-bridge module has been developed for fast-switching SiC devices. The module has a maximum temperature rating of 175°C. There are 12 GE SiC MOSFET chips per switch and the MOSFET's body diode is utilized as the freewheeling diode. The module's typical on-resistance is 3.8mOhms at 25°C and 5.8mOhms at 175°C. Internal loop inductance measured from DC input terminals...
This paper presents the latest 1.2kV–2.2kV SiC MOSFETs designed to maximize SiC device benefits for high-power, medium voltage power conversion applications. 1.2kV, 1.7kV and 2.2kV devices with die size of 4.5mm × 4.5mm were fabricated, exhibiting room temperature on-resistances of 34mOhm, 39mOhm and 41mOhm, respectively. The ability to safely withstand single-pulse avalanche energies of over 17J/cm...
Transient voltage suppressors (TVS) fabricated in silicon carbide (SiC) and subjected to extensive surge testing is presented. The SiC TVS devices can work at high temperatures, have high current density capability, are smaller and have lower capacitance than comparable Si devices. They are also rugged and reliable, capable of withstanding multiple back-to-back lightning hits. These devices are expected...
High voltage and high current SiC bipolar diode modules are fabricated and characterized under static and dynamic conditions. The modules are built using 6×6mm2 SiC chips that are fabricated on 3″ SiC substrates. Individual chips were also packaged in an ISOPLUS™ package and used to perform switching tests on the diodes. The modules have been fully characterized under static and dynamic conditions...
This paper discusses the latest developments in the optimization and fabrication of 3.3kV SiC vertical DMOSFETs. The devices show superior on-state and switching losses compared to the even the latest generation of 3.3kV fast Si IGBTs and promise to extend the upper switching frequency of high-voltage power conversion systems beyond several tens of kHz without the need to increase part count with...
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