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Thermal dissipation is a major concern in microelectronics, especially for compact packages and 3D circuits where the dense stacking of thin silicon layers leads to a significant increase of heat densities. Direct hybrid bonding is considered as one of the most promising technologies for future 3D-ICs. Its face-to-face structure allows significant inter-connexion capabilities but it also implies increased...
Direct hybrid bonding is considered as one of the most promising technologies for high performance 3D-ICs. Its face-to-face structure allows significant inter-connexion capabilities. Nonetheless, it also implies increased thermal densities that will be reflected in both die tiers due to the lack of insulating barriers. This work investigates the thermal interactions between two hybrid bonded dice...
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