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This paper reports the fatigue properties of Sn-Ag-Cu (SAC) and Pb-Sn solder alloys determined from isothermal shear fatigue testing and analysis of resulting data using modified Coffin-Manson fatigue model. In our study, a series of cyclic shear fatigue testing was conducted on the solder joints in PBGA assembly with variation in testing temperature, strain range, and strain rate (or cycle frequency)...
This paper presents the results of isothermal shear fatigue tests conducted on Sn-Ag-Cu lead-free and Pb-Sn solder alloys in fully assembled PBGA configurations. Our study, aimed to better understand the fatigue behaviors of solder alloys in the package assembly, reveals that the shear fatigue test is indeed capable of measuring the fatigue properties of the solder itself and may lead to material...
This paper reports the experimental and theoretical exploration of the fracture mechanism active in BGA lead-free solder assemblies under high speed shear fatigue test conditions. Our investigation finds that, contrary to common assumption, the crack growth in shear fatigue is not governed by shear stress but more by crack opening stress. Our theoretical analysis indicates that fracture by crack opening...
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